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180nm gate length amorphous InGaZnO thin film transistor for high density image sensor applications

机译:180nm栅极长度非晶Ingazno薄膜晶体管用于高密度图像传感器应用

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In this article, we propose a novel hybrid complementary metal oxide semiconductor (CMOS) image sensor architecture utilizing nanometer scale amorphous In-Ga-Zn-O (a-IGZO) thin film transistors (TFT) combined with a conventional Si photo diode. This approach will overcome the loss of quantum efficiency and image quality due to the downscaling of the photodiode. The 180nm gate length a-IGZO TFT exhibits remarkable short channel device performance including a low 1/ƒ noise and a high output gain, despite fabrication temperatures as low as 200°C. The excellent device performance has been achieved by a double layer gate dielectric (Al2O3/SiO2) and a trapezoidal active region formed by a tailored etching process. A self aligned top gate structure was employed for low parasitic capacitance. 3D process simulation tools were applied to optimize a four pixel CMOS image sensor structure. The results demonstrate how our stacked hybrid device approach contributes to new device strategies in image sensor architectures. We expect that this approach is applicable to numerous devices and systems in future micro- and nano-electronics.
机译:在本文中,我们提出了一种新颖的混合互补金属氧化物半导体(CMOS)图像传感器架构利用纳米级非晶In-Ga-Zn-O(A-IGZO)薄膜晶体管(TFT)与传统的Si照片二极管组合。由于光电二极管的缩小,这种方法将克服量子效率和图像质量的损失。尽管制造温度低至200°C,但是180nm栅极长度A-IGZO TFT表现出具有低1 /∞噪声和高输出增益的显着短信设备性能。通过双层栅极电介质(Al 2 O 3 / SIO 2 )和梯形有源区域的实现,实现了优异的装置性能。定制的蚀刻过程。用于低寄生电容的自对准顶部栅极结构。应用了3D过程仿真工具优化四个像素CMOS图像传感器结构。结果表明,我们的堆叠混合设备方法如何为图像传感器架构中的新设备策略作出贡献。我们预计这种方法适用于未来的微型和纳米电子设备的许多设备和系统。

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