首页> 外文会议>NSTI nanotechnology conference and expo;Nanotech conference expo;NSTI-Nanotech 2012;TechConnect world annual conference expo >Optimised Piezoelectric PZT Thin Film Production on 8' Silicon Wafers for Micromechanical Applications
【24h】

Optimised Piezoelectric PZT Thin Film Production on 8' Silicon Wafers for Micromechanical Applications

机译:在微机械应用中在8'硅晶圆上优化压电PZT薄膜生产

获取原文

摘要

Piezoelectric materials are of great interest for new MEMS devices for sensors, actuators and energy harvesting. Due to its large electromechanical coupling coefficient Lead Zirconate Titanate (PZT) is one of the most favourable materials for realisation of fast and energy efficient microactuators. Here we report results of process optimisation for high quality thin film PZT deposition using standard magnetron sputter equipment (Oerlikon Balzers) of up to 2μm thickness at a deposition rate of 45nm/min. A reliable industrial production process was developed leading to optimised material quality for micromechanical applications. High quality films have been prepared on standard 8" silicon wafers using an Oerlikon CLN 200 tool with heated substrate holder. Ti/Pt bottom electrode configuration, deposition temperatures and process control have been varied for optimisation of thin film piezoelectric coefficients. Using Electron Probe Micro Analysis (EPMA) and X-ray diffraction (XRD) it was determined that best material composition and crystalline structure was achieved using a wafer chuck temperature of 600°C. Optimised PZT films of various thicknesses show a high dielectric constant ε_r of about 1500. A remarkable high average transversal piezoelectric module e_(31,f) of -17,3C/m~2 was achieved. An effective longitudinal d_(33,f) coefficient of 160pm/V was determined for 2μm thick PZT films. Using the optimised magnetron sputter process maximum values for the transversal piezoelectric module e_(31,f) of-21C/m~2 have been determined. Top electrodes on PZT thin films were realised in Cr/Au. These electrodes were used as hard masks for structuring of the piezoelectric material. Free standing PZT beams were produced by etch removal of a sacrificial layer below the PZT films. Various designs have been realised. Process flow and design examples for new sound transducers in the sound and ultrasound region are presented and discussed.
机译:对于传感器,执行器和能量收集的新MEMS器件,压电材料具有很大的兴趣。由于其大型机电耦合系数引线锆钛酸锆(PZT)是实现快速和节能微致动器最有利的材料之一。在这里,我们使用标准磁控溅射设备(Oerlikon Balzers)以45nm / min的沉积速率的标准磁控溅射设备(Oerlikon Balzers)报告高质量薄膜PZT沉积的过程优化结果。开发了一种可靠的工业生产过程,导致微机械应用的优化材料质量。使用具有加热基板支架的Oerlikon Cln 200工具在标准8“硅晶片上制备了高质量的薄膜。Ti / Pt底部电极配置,沉积温度和过程控制已经多样化以优化薄膜压电系数。使用电子探针微分析(EPMA)和X射线衍射(XRD)确定使用600℃的晶片卡盘温度实现最佳材料组合物和结晶结构。优化各种厚度的PZT薄膜显示大约1500的高介电常数ε_R。实现了-17,3c / m〜2的显着的高平均横向压电模块E_(31,F)。测定了2μm厚的PZT薄膜的有效纵向D_(33,F)系数160pm / v.使用优化已经确定了横向压电模块E_(31,F)的磁控溅射工艺最大值-21C / m〜2的磁阻压电模块E_(31,F)。PZT薄膜上的顶部电极在Cr / Au中实现。这些电极是我们编辑为压电材料的结构化的硬质面罩。通过蚀刻去除PZT薄膜下方的牺牲层来生产自由驻PZT光束。已经实现了各种设计。呈现并讨论了用于声音和超声区域的新声音传感器的过程流程和设计示例。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号