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Production manner of the piezoelectric body thin film wafer, it has the piezoelectric body thin film on the piezoelectric body thin film

机译:压电体薄膜晶片的生产方式,其在压电体薄膜上具有压电体薄膜

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a piezoelectric thin film wafer, a piezoelectric thin film element, and a piezoelectric thin film device capable of finely processing a piezoelectric thin film in a short time and selectively stopping fine processing.;SOLUTION: A piezoelectric thin film wafer 1 equipped with a piezoelectric thin film 4 on a substrate 2 is manufactured by a first processing step of performing ion etching using a gas including Ar and a second processing step of performing reactive ion etching using a mixed etching gas of a reactive gas and Ar. Only a piezoelectric thin film 4 can be etched in a short time.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种压电薄膜晶片,压电薄膜元件和压电薄膜装置的制造方法,其能够在短时间内精细处理压电薄膜并选择性地停止精细处理。通过在第一处理步骤中使用包括Ar的气体进行离子蚀刻,并且在第二处理步骤中使用混合后的Al 2+气体进行反应性离子蚀刻,来制造在基板2上配备有压电薄膜4的压电薄膜晶片1。反应气体和Ar。在短时间内只能蚀刻压电薄膜4。版权所有:(C)2012,JPO&INPIT

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