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Sb_2Te_3 and Bi_2Te_3 Thin Films Grown by Molecular Beam Epitaxy at Room Temperature

机译:分子束外延在室温下生长的Sb_2Te_3和Bi_2Te_3薄膜

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Nano-alloyed p-type Sb_2Te_3 and n-type Bi_2Te_3 thin films were grown on SiO_2/Si and BaF_2 substrates by molecular beam epitaxy (MBE) in two steps: (i) Repeated deposition of fivelayer stacks with sequence Te-X-Te-X-Te (X = Sb or Bi) with elemental layer thicknesses of 0.2 nm on substrates at room temperature, (ii) annealing at 250 °C for two hours at which phase formation of Sb_2Te_3 or Bi_2Te_3 occurred. The room temperature MBE deposition method reduces surface roughness, allows the use of non lattice-matched substrates, and yields a more accurate and easier control of the Te content compared to Bi_2Te_3 thin films, which were epitaxially grown on BaF_2 substrates at 290 °C. X-ray diffraction revealed that the thin films were single phase, poly-crystalline, and textured. The films showed grain sizes of 500 nm for Sb_2Te_3 and 250 nm for Bi_2Te_3, analyzed by transmission electron microscopy (TEM). The in-plane transport properties (thermopower S, electrical conductivity a, charge carrier density n, charge carrier mobility μ, power factor S~σ) were measured at room temperature. The nano-alloyed Sb_2Te_3 thin film revealed a remarkably high power factor of 29 μW cm~(-1) K~(-2) similar to epitaxially grown Bi_2Te_3 thin films and Sb_2Te_3 single crystalline bulk materials. This large power factor can be attributed to a high charge carrier mobility of 402 cm~2 V~(-1) s~(-1) similar to high-ZT Bi_2Te_3/Sb_2Te_3 superlattices. However, for the nano-alloyed Bi_2Te_3 thin film a low power factor of 8 μW cm~(-1) K~(-2) and a low charge carrier mobility of 80 cm~2 V~(-1) s~(-1) were found. Detailed microstructure and phase analyses were carried out by energy-filtered TEM in cross-sections. Quantitative chemical analysis by energy-dispersive x-ray spectroscopy (EDS) was also applied. In Bi_2Te_3 thin films, few nanometer thick Bi-rich blocking layers at grain boundaries and Te fluctuations by 1.3 at.% within the grains were observed. The small charge carrier densities are explained by a reduced antisite defect density due to the low temperatures to which the thin films were exposed during annealing.
机译:通过分子束外延(MBE)通过两个步骤在SiO_2 / Si和BaF_2衬底上生长纳米合金化的p型Sb_2Te_3和n型Bi_2Te_3薄膜:(i)重复沉积具有序列Te-X-Te-的五层堆叠X-Te(X = Sb或Bi)在室温下在基板上的元素层厚度为0.2 nm,(ii)在250°C退火2小时,在此期间发生Sb_2Te_3或Bi_2Te_3的相形成。与在290°C外延生长在BaF_2衬底上的Bi_2Te_3薄膜相比,室温MBE沉积方法可降低表面粗糙度,允许使用非晶格匹配的衬底,并能更准确,更轻松地控制Te含量。 X射线衍射表明该薄膜是单相的,多晶的和有纹理的。通过透射电子显微镜(TEM)分析,该膜显示出Sb_2Te_3的晶粒尺寸为500nm,Bi_2Te_3的晶粒尺寸为250nm。在室温下测量面内传输特性(热功率S,电导率a,电荷载流子密度n,电荷载流子迁移率μ,功率因数S〜σ)。与外延生长的Bi_2Te_3薄膜和Sb_2Te_3单晶块状材料相似,纳米合金化Sb_2Te_3薄膜显示出29μWcm〜(-1)K〜(-2)的高功率因数。该高功率因数可归因于类似于高ZT Bi_2Te_3 / Sb_2Te_3超晶格的402 cm〜2 V〜(-1)s〜(-1)的高载流子迁移率。然而,对于纳米合金Bi_2Te_3薄膜,其低功率因数为8μWcm〜(-1)K〜(-2),电荷载流子迁移率较低,为80 cm〜2 V〜(-1)s〜(- 1)被发现。通过能量过滤TEM在横截面中进行了详细的微观结构和相分析。还应用了通过能量色散X射线光谱法(EDS)进行的定量化学分析。在Bi_2Te_3薄膜中,在晶界处观察到很少的纳米厚的富Bi阻挡层,并且在晶粒内Te的波动为1.3 at。%。电荷载流子密度低的原因是由于退火过程中薄膜所暴露的低温导致降低的反位缺陷密度。

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