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Design Fabrication of a MEMS Piezoresistive Accelerometer with Beam-film Combined Structure

机译:束膜结合结构的MEMS压阻式加速度计的设计与制作

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In this paper,a MEMS (micro-electro-mechanical system) accelerometer has been developed utilizing piezoresistive sensing elements for vibration measurements in large-scale rotating machineries.The accelerometer consists of highly symmetric beam-film combined structure with 4 p-type piezoresistors diffused on beam surface.The beam and two same films,acting as a whole,give the structure a higher mechanical stiffness making the accelerometer's nature frequency enhanced.During the chip design,classical vibration and elasticity theories are taken advantaged of to determine the dimensions of the sensor chip based on the requirements of industrial practical application.FEM (finite element method) is also used to investigate the performances of the sensor under acceleration load.The device is fabricated by using bulk micromachining technology,and an n-type,(100) oriented silicon wafer is used as the blank of the chip.The packaged sensor is tested and the experimental results show that the sensor has a sufficient linear response (non-linearity≤0.26%FS) up to 50g with a sensitivity of 1.5mV/g/8V.The resonance frequency of the sensor is about2860Hz,and this allows the usage of the sensor in state monitoring with the necessary bandwidth.
机译:本文开发了一种利用压阻传感元件在大型旋转机械中进行振动测量的MEMS(微机电系统)加速度计。该加速度计由高度对称的束膜组合结构和扩散的4个p型压敏电阻组成该梁和两个相同的薄膜作为一个整体起作用,使结构具有更高的机械刚度,从而使加速度计的固有频率得以提高。在芯片设计期间,利用经典的振动和弹性理论来确定加速度传感器的尺寸。该传感器芯片是根据工业实际应用的要求而设计的。还使用有限元方法(FEM)来研究传感器在加速负载下的性能。该器件是采用本体微机械加工技术制造的,具有n型,(100)取向的硅片作为芯片的坯料。对封装的传感器进行了测试,实验结果表明或具有高达50g的足够线性响应(非线性≤0.26%FS),灵敏度为1.5mV / g / 8V。传感器的共振频率约为2860Hz,因此可以在状态监测中使用该传感器。必要的带宽。

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