Electromagnetic induced heating for rapid thermal cycling of single SnAgCu solder joint in double substrates

摘要

The thermal fatigue behavior of the solder joint treated by electromagnetic induced heating is investigated in the present study. The microstructures and compositions of solder joints were observed and analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray system (EDXS) respectively. An approach to rapid thermal cycles by high-frequency electromagnetic induction heating was also presented in terms of numerical simulation. It was found that rapid thermal cycle has an evident influence on the microstructure and IMC between SAC305 solder and Cu substrate. The results showed that there is a rimous cracks phenomenon in the microstructure of the solder balls after rapid thermal cycle. The results indicate that this method by local induction heating is feasible to investigate the thermal fatigue behaviors of solder joint. This method can also effectively improve the reliability of the electronic packaging devices.