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Fully Integrated 300 GHz Receiver S-MMICs in 50 nm Metamorphic HEMT Technology

机译:采用50 nm变形HEMT技术的完全集成300 GHz接收器S-MMIC

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摘要

Two fully integrated H-band (220-325 GHz) submillimeter-wave monolithic integrated circuit (S-MMIC) heterodyne receivers have been successfully developed, based on a 50 nm metamorphic high electron mobility transistor (mHEMT) technology. A fabricated fundamental down-conversion receiver achieved a conversion gain of more than 11 dB in the frequency range from 270 to 310 GHz with an LO power of only 12 dBm. Furthermore, a subharmonic receiver S-MMIC was developed, consisting of an active frequency multiplier by three, a two stage driver amplifier, a single-ended resistive mixer, and a four-stage low-noise amplifier, demonstrating a conversion gain of more than 12 dB from 290 to 320 GHz with a subharmonic LO-power of 8 dBm. Grounded coplanar waveguide (GCPW) topology in combination with cascode transistors resulted in a very compact die size of less than 1.25 mm^2.
机译:基于50 nm变形高电子迁移率晶体管(mHEMT)技术,已经成功开发了两个完全集成的H波段(220-325 GHz)亚毫米波单片集成电路(S-MMIC)外差接收器。预制的基本下变频接收器在270至310 GHz的频率范围内实现了超过11 dB的转换增益,LO功率仅为12 dBm。此外,还开发了一种次谐波接收器S-MMIC,它由一个三倍的有源倍频器,一个两级驱动器放大器,一个单端电阻混频器和一个四级低噪声放大器组成,其转换增益大于1。在290至320 GHz范围内为12 dB,次谐波LO功率为8 dBm。接地共面波导(GCPW)拓扑与共源共栅晶体管的结合导致了非常紧凑的裸片尺寸,小于1.25 mm ^ 2。

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