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Monte Carlo Simulation of Impact of Random Telegraph Noise in 45 nm MOSFET Due to Combined Effects of Random Interface Traps and Random Channel Dopant Distributions

机译:由于随机界面陷阱和随机沟道掺杂物分布共同作用而对45 nm MOSFET中随机电报噪声的影响的蒙特卡罗模拟

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This paper presents a 3-D Ensemble Monte Carlo (EMC) based simulation for 45 nm gate length MOSFET to account for the fluctuations in drain current (saturation) and threshold voltage as causes of reliability failures integrating the effects of (1) statistical fluctuations in number and position of the dopant atom (RDF) in the channel region and (2) trapping or de-trapping of single or multiple carriers in the defect states positioned near the Si:SiO_2 interface and at random locations in the inversion region between source and drain. Our thorough investigations suggest that the fluctuations in threshold voltage and its standard deviation are considerably larger than the on-current fluctuations for randomly chosen dopant distributions in the channel and bulk regions. In addition, the random location and number of trap are not correlated with those of channel dopants making the reliability projection dependent on averaged statistic of a large number of random channel dopants and strategic positioning of the traps in the channel.
机译:本文针对45 nm栅极长度MOSFET提出了一种基于3-D集成蒙特卡罗(EMC)的仿真方法,以将漏极电流(饱和)和阈值电压的波动作为可靠性故障的原因加以考虑,并综合了(1)统计波动的影响。沟道区域中掺杂原子(RDF)的数量和位置;(2)处于Si:SiO_2界面附近以及源极与源极之间的反转区域中随机位置处的缺陷状态中的单个或多个载流子的俘获或去俘获。流走。我们的深入研究表明,阈值电压及其标准偏差的波动要比沟道和主体区域中随机选择的掺杂物分布的导通电流波动大得多。另外,陷阱的随机位置和数量与沟道掺杂剂的位置和数量不相关,使得可靠性预测取决于大量随机沟道掺杂剂的平均统计量和陷阱在沟道中的策略性定位。

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