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Simulation of charge-trapping in nano-scale MOSFETs in the presence of random-dopants-induced variability

机译:在存在随机掺杂剂引起的可变性的情况下模拟纳米级mOsFET中的电荷俘获

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摘要

The growing variability of electrical characteristics is a major issue associated with continuous downscaling of contemporary bulk MOSFETs. In addition, the operating conditions brought about by these same scaling trends have pushed MOSFET degradation mechanisms such as Bias Temperature Instability (BTI) to the forefront as a critical reliability threat. This thesis investigates the impact of this ageing phenomena, in conjunction with device variability, on key MOSFET electrical parameters. A three-dimensional drift-diffusion approximation is adopted as the simulation approach in this work, with random dopant fluctuations—the dominant source of statistical variability—included in the simulations. The testbed device is a realistic 35 nm physical gate length n-channel conventional bulk MOSFET. 1000 microscopically different implementations of the transistor are simulated and subjected to charge-trapping at the oxide interface. The statistical simulations reveal relatively rare but very large threshold voltage shifts, with magnitudes over 3 times than that predicted by the conventional theoretical approach. The physical origin of this effect is investigated in terms of the electrostatic influences of the random dopants and trapped charges on the channel electron concentration. Simulations with progressively increased trapped charge densities—emulating the characteristic condition of BTI degradation—result in further variability of the threshold voltage distribution. Weak correlations of the order of 10-2 are found between the pre-degradation threshold voltage and post-degradation threshold voltage shift distributions. The importance of accounting for random dopant fluctuations in the simulations is emphasised in order to obtain qualitative agreement between simulation results and published experimental measurements. Finally, the information gained from these device-level physical simulations is integrated into statistical compact models, making the information available to circuit designers.
机译:电气特性的不断变化是与当代体MOSFET不断缩小尺寸相关的主要问题。此外,这些相同的缩放趋势带来的工作条件将MOSFET退化机制(如偏置温度不稳定性(BTI))推向了最重要的可靠性威胁。本文研究了这种老化现象以及器件的可变性对MOSFET关键电参数的影响。在这项工作中,采用了三维漂移扩散近似作为模拟方法,模拟中包括了随机的掺杂物波动(统计变异性的主要来源)。该测试台器件是现实的35 nm物理栅极长度的n通道常规体MOSFET。模拟了晶体管的1000种微观不同的实现,并在氧化物界面处进行了电荷捕获。统计仿真显示相对罕见但非常大的阈值电压漂移,其幅度是传统理论方法所预测的幅度的3倍以上。根据随机掺杂剂和俘获电荷对沟道电子浓度的静电影响,研究了这种效应的物理起因。随着捕获电荷密度的逐渐增加的模拟(模拟BTI退化的特征条件)会导致阈值电压分布的进一步变化。在退化前阈值电压和退化后阈值电压偏移分布之间发现了10-2量级的弱相关。强调了在模拟中考虑随机掺杂物波动的重要性,以便获得模拟结果与已发布的实验测量之间的定性一致性。最后,将从这些设备级物理仿真中获得的信息集成到统计紧凑模型中,从而使电路设计人员可以使用这些信息。

著录项

  • 作者

    Bukhori Muhammad Faiz;

  • 作者单位
  • 年度 2011
  • 总页数
  • 原文格式 PDF
  • 正文语种 English
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