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Repetitive avalanche cycling of low-voltage power trench n-MOSFETs

机译:低压功率沟槽n-MOSFET的重复雪崩循环

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Low voltage discrete power trench n-MOSFETs in TO-220 packages have been subjected to over 200 million cycles of repetitive unclamped inductive switching (UIS) at a mounting base temperature of 150° C and at different avalanche currents. Hot-hole injection into the gate dielectric during avalanche conduction causes a reduction in the threshold voltage as the number of avalanche cycles increase. The relationship between the change in the threshold voltage and the number of avalanche cycles is shown to be a power-law with the pre-factor dependent on the test conditions and the MOSFET technology. Experiments show that the power law pre-factor is proportional to the avalanche current in agreement with the predictions of the “lucky-electron” model. Interestingly, the pre-factor also responds proportionally to the MOSFETs cell pitch. A 40% increase in the avalanche current caused a 30% increase in the power law pre-factor while a 37.5% reduction in the MOSFETs cell pitch caused a 40% reduction in the power law pre-factor. Smaller cell pitch MOSFETs also exhibit improved on-state resistance stability with avalanche cycling however with higher drain-source leakage.
机译:在150°C的安装基础温度和不同的雪崩电流下,TO-220封装中的低压分立功率沟槽n-MOSFET经受了超过2亿次重复的非钳位电感开关(UIS)循环。随着雪崩循环次数的增加,在雪崩传导期间将热空穴注入栅极电介质会导致阈值电压降低。阈值电压的变化与雪崩循环数之间的关系显示为幂律,其预因子取决于测试条件和MOSFET技术。实验表明,幂律因子与雪崩电流成正比,与“幸运电子”模型的预测一致。有趣的是,预因子也与MOSFET的单元间距成比例地响应。雪崩电流增加40%导致功率定律系数增加30%,而MOSFET单元间距减小37.5%导致功率定律系数减少40%。较小的单元间距MOSFET在雪崩循环时也表现出改善的导通状态电阻稳定性,但是漏源漏电流更高。

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