Silicon front-end and assembly and packaging technology more and more merge. In addition interconnect density reaches limits for advanced CMOS technology. In this paper we introduce the fan-out embedded wafer level packaging technology, which is an example to link front-end and packaging technology and offers additional freedom for interconnect design. We demonstrate capabilites for system integration of the eWLB technology, which includes system on chip (SoC) integration and system in package (SiP) integration like side by side and stacking of devices. We highlight the importance of understanding properties of new materials, which influence warpage or heat dissipation. We also show the excellent performance of the eWLB package for mm-wave applications.
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