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TLP characterization for testing system level ESD performance

机译:TLP表征可测试系统级ESD性能

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A case study of system level ESD protection is presented for a scheme requiring compliance to the IEC 61000–4–2 standard. The behavior of the circuit was analyzed using TLP testing under biased conditions. Compared to the unbiased case, it was found that the response of the circuit becomes erratic at the lower current levels under the external bias leading to an unexpected early failure during the system level ESD test. Improving the triggering response of the ESD clamp to overcome this effect in the presence of an external bias greatly enhanced the system level ESD performance. The biased TLP analysis was found to be a useful tool to study the IEC performance.
机译:针对要求符合IEC 61000–4–2标准的方案,提供了系统级ESD保护的案例研究。使用TLP测试在偏置条件下分析了电路的行为。与无偏的情况相比,发现在外部偏置下较低的电流水平下,电路的响应变得不稳定,从而导致在系统级ESD测试期间出现意外的早期故障。在存在外部偏置的情况下,改善ESD钳位器的触发响应以克服此影响,可大大提高系统级ESD性能。发现有偏向的TLP分析是研究IEC性能的有用工具。

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