In electronic product, reliability of solder joint has big impact on the function of the whole electronic product. In the design period of the package, it is important to predict solder joint thermal fatigue lifetime and analyze the effect of each factors on the lifetime of solder joint. Finite Element Analysis (FEA) based solder joint lifetime prediction method, which used Anand viscoplastic constitutive function and Darveaux lifetime perdition model is programmed use Visual Basic language. With this software, effect of temperature, solder material, height, diameter and gap of solder joint, thickness, Young's modulus and CTE of substrate on solder joint lifetime are analyzed. Results show that these factors have different effect on solder joint life which is benefit to the optimization of package structure.
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