Reliability of indium solder die bonding of high power cm-bars

摘要

High power semiconductor lasers have found increased applications. Indium solder is one of the most widely used solders in high power laser die bonding, its' reliability is rated as the key parameter deciding about the more or less extensive use of indiun solder die bonding of high power diode arrays. In this paper, 20 samples were tested under two conditions, three degradation modes were observed during the lifetime test, the failure analysis results showed that the stress and defects induced during the indium solder bonding process play a key role in the degradation behavior of the bars.