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High doping effects on in-situ Ohmic contacts to n-InAs

机译:对原位欧姆接触n-InAs的高掺杂效应

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We present the effect of active carrier concentration on the specific contact resistivity (ρc) of in-situ molybdenum (Mo) Ohmic contacts to n-type InAs. It is observed that, although the Fermi level pins in the conduction band for InAs, the contact resistivity decreases with the increase in InAs active carrier concentration. The lowest ρc obtained through transmission line model measurements was (0.6±0.4)×10−8 Ω-cm2 for samples with 8.2×1019 cm−3 active carrier concentration. The contacts were found to remain stable on annealing at 250 °C for 1 hour.
机译:我们提出了活性载流子浓度对n型InAs原位钼(Mo)欧姆接触的比接触电阻率(ρ c )的影响。观察到,尽管费米能级钉扎在InAs的导带中,但接触电阻率随InAs活性载流子浓度的增加而降低。通过传输线模型测量获得的最低ρ c 对于8.2×的样本为(0.6±0.4)×10 −8 Ω-cm 2 10 19 cm −3 活性载流子浓度。发现触点在250°C退火1小时后保持稳定。

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