首页> 外国专利> Integrated circuit with IGFETs - has highly doped ohmic contact surrounded by low doped second conductivity region within one IGFET zone

Integrated circuit with IGFETs - has highly doped ohmic contact surrounded by low doped second conductivity region within one IGFET zone

机译:具有IGFET的集成电路-在一个IGFET区域内具有高掺杂的欧姆接触,被低掺杂的第二导电区域包围

摘要

The semiconductor substrate of the integrated circuit has at least one region of first conductivity and at least two zones of second conductivity, surrounding each other at a distance. On the substrate surface and insulating zone is provided between the conductive zones and is coated with a conductive zone. An ohmic contact (32, 38) is highly doped and is surrounded of a lowly doped region (42) of the second conductivity within one zone of the pair (26). The lowly doped region (42) has preferably a surface resistance of at least 1 kOhm. The highly doped contact on the other hand has a surface resistance not exceeding 50 ohms.
机译:集成电路的半导体衬底具有彼此隔开一定距离的至少一个第一导电性区域和至少两个第二导电性区域。在衬底表面上,绝缘区设置在导电区之间,并涂覆有导电区。欧姆接触(32、38)是高掺杂的,并且在该对(26)的一个区域内被第二导电率的低掺杂区域(42)围绕。低掺杂区(42)优选具有至少1kOhm的表面电阻。另一方面,高掺杂触点的表面电阻不超过50欧姆。

著录项

  • 公开/公告号DE2817473A1

    专利类型

  • 公开/公告日1979-10-31

    原文格式PDF

  • 申请/专利权人 RCA CORP.;

    申请/专利号DE19782817473

  • 发明设计人 FRANCIS DINGWALLANDREW GORDON;

    申请日1978-04-21

  • 分类号H01L27/08;H01L29/78;

  • 国家 DE

  • 入库时间 2022-08-22 19:45:45

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