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Head-On-Pillow Defect - A Pain in the Neck or Head-On-Pillow BGA Solder Defect

机译:枕头缺陷-颈部疼痛或枕头BGA焊料缺陷

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摘要

The head on pillow defect is becoming more common. This paper describes one such occurrence for an OEM and explains how it was dealt with. In this particular case it was solved by application of problem solving skills by the OEM, component supplier and the solder paste provider.
机译:头枕缺陷正变得越来越普遍。本文描述了OEM发生的这种情况,并说明了如何处理。在这种特殊情况下,可以通过OEM,组件供应商和焊膏供应商应用问题解决技能来解决。

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