无铅BGA枕头缺陷的研究

摘要

BGA枕头焊点的锡膏和锡球完全没有融合成为一体,倒过来看就像头压在枕头上面。介绍了四种有效的检测方法。从设计、材料和工艺三方面分析了枕头缺陷的潜在影响因素。选取PCB玻璃态转化温度、钢网厚度、BGA贴装偏移量和回流焊炉链条速度四个因素进行两水平全因子实验设计,在成功复制枕头缺陷的基础上,分析了各因素的影响作用,得出了链条速度是最显著的影响因素。%Solder paste and solder ball are not completely fused into one BGA head-in-pillow, Upside down as head on a pillow. Four effective methods for observing are introduced. And analyze the potential factors of this defect from design, materials and process. Then select PCB θg point, stencil thickness, BGA mounting deviant and reflow chain speed as four factors to DOE. After successfully copy the head-in-pillow defect, discuss the effect of all factors. Finally find that the chain speed is the most significant one.