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Sidewall resistance reduction for FinFETs by B2H6/Helium Self-Regulatory Plasma Doping process

机译:B 2 H 6 /氦气自调节等离子体掺杂工艺可降低FinFET的侧壁电阻

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The Self-Regulatory Plasma Doping (SRPD) technique with B2H6/Helium gas plasma for PMOS FinFETs has been aggressively developed. Low resistance of the side surface of fins has been successfully demonstrated. The obtained value of the sheet resistance of the side surface is 910 ohm/sq. This sheet resistance is lower than International Technology Roadmap for Semiconductors 2009 Edition (ITRS 2009) required value of maximum drain extension sheet resistance for multi-gate MPU/ASIC (PMOS) at year 2015. The SRPD process reported in this paper will be the excellent doping method for PMOS FinFETs extension for 22 nm node and beyond.
机译:用于PMOS FinFET的具有B2H6 /氦气等离子体的自调节等离子体掺杂(SRPD)技术已得到积极发展。散热片侧面的低电阻已被成功证明。所获得的侧面的薄层电阻值为910ohm / sq。该薄层电阻低于2015年国际半导体技术路线图(ITRS 2009)要求的多栅极MPU / ASIC(PMOS)最大漏极扩展薄层电阻的值。本文报道的SRPD工艺将是出色的PMOS FinFET扩展至22 nm及以上节点的掺杂方法。

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