首页> 外文会议>Silicon Carbide and Related Materials 2007 >Effect of Gate Wet Reoxidation on Reliability and Channel Mobility of Metal-oxide-semiconductor Field-effect Transistors Fabricated on 4H-SiC (0001)
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Effect of Gate Wet Reoxidation on Reliability and Channel Mobility of Metal-oxide-semiconductor Field-effect Transistors Fabricated on 4H-SiC (0001)

机译:栅极湿法再氧化对在4H-SiC上制造的金属氧化物半导体场效应晶体管的可靠性和沟道迁移率的影响(0001)

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The channel mobility and oxide reliability of metal-oxide-semiconductor field-effect transistors (MOSFETs) on 4H-SiC (0001) carbon face were investigated. The gate oxide was fabricated by using dry-oxidized film followed by pyrogenic reoxidation annealing (ROA). Significant improvements in the oxide reliability were observed by time-dependent dielectric breakdown (TDDB) measurement. Furthermore, the field-effect inversion channel mobility (μ_(FE)) of MOSFETs fabricated by using pyrogenic ROA was as high as that of conventional 4H-SiC (0001) MOSFETs having the pyrogenic-oxidized gate oxide. It is suggested that the pyrogenic ROA of dry oxide as a method of gate oxide fabrication satisfies both channel mobility and oxide reliability on 4H-SiC(0001) carbon-face MOSFETs.
机译:研究了4H-SiC(0001)碳面上的金属氧化物半导体场效应晶体管(MOSFET)的沟道迁移率和氧化物可靠性。通过使用干氧化膜,然后进行热原性再氧化退火(ROA)来制造栅极氧化物。通过时间相关的介电击穿(TDDB)测量,可以观察到氧化物可靠性的显着提高。此外,通过使用热解ROA制造的MOSFET的场效应反转沟道迁移率(μ_(FE))与具有热解氧化的栅极氧化物的常规4H-SiC(0001)MOSFET的场效应反转沟道迁移率一样高。建议干氧化物的热解ROA作为制造栅极氧化物的一种方法,可以同时满足4H-SiC(0001)碳面MOSFET的沟道迁移率和氧化物可靠性。

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