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Vertical slit transistor based integrated circuits (VeSTICs) paradigm

机译:基于垂直缝晶体管的集成电路(VeSTIC)范例

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In this presentation new, unorthodox (i.e. ITRS incompatible), IC design/manufacturing paradigm is proposed. This paradigm has been conceived as a response to the rapidly growing complexity and increasing number of stumbling blocks posed by the nano-scale IC era. It has been constructed using notion of a strict layout regularity imposed on IC layout. Such restriction is seen as a remedy for dramatic increase of litho cost and complexity expected to be major issues for the "below-32-nm" products. Such regularity has been discussed in the past for IC interconnects. Focus of this talk is on active devices. The central element of the proposed vision is Vertical Slit Field Effect Transistor (VeSFET). It is shown that Vertical Slit Transistor based integrated circuits (VeSTICs) may enable much denser, much easier to design, test and manufacure, as well as, easily 3D-extendable and OPC-free ICs. The proposed paradigm has been developed assuming that it must reuse CMOS-based desig/manufdacturing infrasrtuctur and expertise that does exist today.
机译:在本演示中,提出了新的,非传统的(即与ITRS不兼容)IC设计/制造范例。这种范例被认为是对纳米集成电路时代所带来的迅速增长的复杂性和越来越多的绊脚石的回应。它是使用对IC布局施加严格的布局规律性的概念构建的。这种限制被视为补救光刻成本急剧增加和复杂性的补救措施,而光刻成本和复杂性预计将成为“ 32纳米以下”产品的主要问题。过去已经针对IC互连讨论了这种规律性。本演讲的重点是有源设备。拟议愿景的核心要素是垂直狭缝场效应晶体管(VeSFET)。结果表明,基于垂直狭缝晶体管的集成电路(VeSTIC)可以使密度更高,更易于设计,测试和制造,以及易于3D扩展和无OPC的IC。假设必须重用当今确实存在的基于CMOS的设计/制造基础设施和专业知识,则已开发出所提出的范例。

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