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Vertical slit transistor based integrated circuits (VeSTICs) paradigm

机译:基于垂直的狭缝晶体管的集成电路(前院)范式

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In this presentation new, unorthodox (i.e. ITRS incompatible), IC design/manufacturing paradigm is proposed. This paradigm has been conceived as a response to the rapidly growing complexity and increasing number of stumbling blocks posed by the nano-scale IC era. It has been constructed using notion of a strict layout regularity imposed on IC layout. Such restriction is seen as a remedy for dramatic increase of litho cost and complexity expected to be major issues for the "below-32-nm" products. Such regularity has been discussed in the past for IC interconnects. Focus of this talk is on active devices. The central element of the proposed vision is Vertical Slit Field Effect Transistor (VeSFET). It is shown that Vertical Slit Transistor based integrated circuits (VeSTICs) may enable much denser, much easier to design, test and manufacure, as well as, easily 3D-extendable and OPC-free ICs. The proposed paradigm has been developed assuming that it must reuse CMOS-based desig/manufdacturing infrasrtuctur and expertise that does exist today.
机译:在本演示文稿中,提出了IC设计/制造范式的新的,非正统(即ITRS)。该范式被认为是对快速增长的复杂性和越来越多的纳米级IC时代提出的绊倒块的反应。它已经使用IC布局强加的严格布局规律性的概念构建。这种限制被视为戏剧性地增加了Litho成本和复杂性的补救措施,预计将成为“32纳米以下”产品的主要问题。过去的IC互连已经讨论了这种规律性。此谈话的重点是活动设备。所提出的视觉的中心元素是垂直狭缝场效应晶体管(VESFET)。结果表明,基于垂直的狭缝晶体管的集成电路(前院)可以实现更密集,更容易设计,测试和制造,以及易于3D可扩展的和无OPC的IC。拟议的范式已经开发,假设它必须重用基于CMOS的DESIG / Manufduce,而不是今天存在的专业知识。

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