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Ideal N-type SiC/metal Contacts by Reduction of the Density of Interface State

机译:降低界面态密度,理想的N型SiC /金属触点

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The ideal SiC/metal contacts were formed by controlling the barrier height on the ideal SiC surface. The ideal SiC surface was realized by lowering the density of surface states owing to SiC surface hydrogenation. The mechanism of surface hydrogenation was studied in this paper. Using the surface hydrogenation treatment, SiC Schottky diodes with ideality factor of 1.2~1.25 and ohmic contacts with specific contact resistance of 5×10-3~7×10-3Ω.cm2 were obtained below 100°C for the first time. Its advantages lay in not only avoiding the annealing at 800-1200°C for Ohmic contacts in the conventional process, but also improving the electrical performances of SiC Schottky diodes.
机译:通过控制理想SiC表面上的势垒高度,可以形成理想的SiC /金属触点。通过降低由于SiC表面氢化而引起的表面态密度,可以实现理想的SiC表面。研究了表面加氢机理。通过表面氢化处理,首次在100℃以下获得了理想因子为1.2〜1.25的SiC肖特基二极管和比接触电阻为5×10-3〜7×10-3Ω.cm2的欧姆接触。它的优点不仅在于避免了传统工艺中欧姆接触在800-1200°C下的退火,而且还改善了SiC肖特基二极管的电性能。

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