Simulation and experimental analysis for a ball stitch on bump wire bonding process above a laminate substrate

摘要

This study focuses on a ball stitch on bump (BSOB) wire bonding process above a laminate substrate by modeling and experiment. The goals of our study are: (1) to determine the stress and deformation mechanism of BSOB wire bonding process on laminate substrate; (2) to understand the impact of wire bonding parameters. The simulation includes the ultrasonic transient dynamic bonding process, and the stress wave transferred to the interface between bond structure and laminate substrate. Different laminate material parameters are studied for the optimized solution. Different ultrasonic parameters of bonding force and frequency are studied and discussed for the effects of bonding process on laminate substrate structures with partial supports. Experimental test work includes a DOE study with different parameters of ultrasonic power and bonding force. Finally, the comparison of modeling and experimental results is provided