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The Influence of Low Level Doping on the Thermal Evolution of SAC Alloy Solder Joints with Cu Pad Structures

机译：低水平掺杂对SAC合金铜焊盘钎料焊接点热演化的影响

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《Electronic Components and Technology Conference, 2006. Proceedings. 56th》|2006年|P.1454-1461|共8页
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de Sousa I.; Henderson D.W.; Parry L.; Kang S.K.; Shih D.-Y.;
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1. Effect of Doped Nano-Ni on Microstructure Evolution and Mechanical Behavior of Sn-3.0Ag-0.5Cu (SAC305)/Cu-2.0Be Solder Joint during Isothermal Aging [J] . Journal of Materials Engineering and Performance . 2020,第5期

机译：掺杂纳米Ni对Sn-3.0Ag-0.5Cu（SAC305）/cu-2.0Be焊点在等温老化期间的微观结构演化和力学行为的影响
2. Effect of doping Ni nanoparticles on microstructure evolution and shear behavior of Sn-3.0Ag-0.5Cu(SAC305)/Cu-2.0Be solder joints during reflowing [J] . Zuozhu Yin, Mei Lin, Qi Li, Journal of materials science . 2020,第6期

机译：掺杂Ni纳米粒子对Sn-3.0AG-0.5Cu（SAC305）/cu-2.0BE焊点的微观结构演化与剪切行为的影响
3. Evolution of microstructure and mechanical properties of Cu/SAC305/Cu solder joints under the influence of low ultrasonic power [J] . Tan Ai Ting, Tan Ai Wen, Yusof Farazila Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics . 2017,第期

机译：低超声波影响下Cu / SAC305 / Cu焊点的微观结构和力学性能的演变
4. The Influence of Low Level Doping on the Thermal Evolution of SAC Alloy Solder Joints with Cu Pad Structures [C] . de Sousa I., Henderson D.W., Patry L., Electronic Components and Technology Conference . 2006

机译：低水平掺杂对Cu垫结构囊合金焊点热演变的影响
5. Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints [D] . Choubey, Anupam 2007

机译：锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响，包括混合焊点在等温老化下的微观结构变化
6. Microstructure Influence of SACX0307-TiO2 Composite Solder Joints on Thermal Properties of Power LED Assemblies [O] . Agata Skwarek, Przemysław Ptak, Krzysztof Górecki, 2020

机译：SACX0307-TiO2复合焊点的微观结构对功率LED组件热性能的影响
7. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging [O] . Liu Yang, Meerwijk Joost, Luo Liangliang, 2014

机译：回流和时效后，SAC305 / Ag / Cu和SAC0705-Bi-Ni / Ag / Cu焊点界面处金属间层结构的形成和演变

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