Computational Mechanics Aided Reliability Assessment of Interconnections in Advanced Electronics Packaging

摘要

In this study, several applications of the finite element analysis (FEA) are introduced in the analysis of the electronic packaging reliability.In order to obtain the solder material parameters, finite element analysis was applied to evaluate the experimental results with a complex shaped specimen. Cyclic tests of Sn4.0Ag0.5Cu BGA solder joints attached between two printed circuit boards were studied. This solder joint specimen has a complex shape and material combination i.e. solder material and organic substrates.The creep and relaxation behaviors of a wafer-level CSP assembly under two types of thermal loading conditions were investigated using high sensitivity moire interferometry and FEA. One is a thermal load from 100°C to room temperature and the other is from room temperature to 100°C. The test results obtained from the moire interferometry measurements were compared with the predicted values obtained from finite element analysis. It is shown that the deformation values predicted from finite element analysis have a good agreement with those obtained from the tests.