首页> 外文会议>Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International >Self-limiting laser thermal process for ultra-shallow junction formation of 50-nm gate CMOS
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Self-limiting laser thermal process for ultra-shallow junction formation of 50-nm gate CMOS

机译:自限制激光热工艺可形成50nm栅极CMOS的超浅结

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We have developed a novel LTP (laser thermal process) that dramatically enhances the laser exposure window by controlling the heating process in a self-limiting way (SL-LTP). The Vth roll-offs of MOSFETs formed by this method were remarkably improved compared to those by RTA when offset-spacer and halo-implantation processes were not applied. Its effectiveness was also verified in 50-nm gate CMOS devices for the first time by confirming that the drain current increased with laser fluence beyond the conventional exposure limit.
机译:我们已经开发了一种新颖的LTP(激光热过程),该LTP通过以自限方式(SL-LTP)控制加热过程来显着增强激光曝光窗口。与不使用偏置间隔和卤素注入工艺的RTA相比,通过此方法形成的MOSFET的Vth滚降得到了显着改善。通过确认漏电流随着激光通量的增加而超过传统的曝光极限,也首次在50nm栅极CMOS器件中验证了其有效性。

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