首页> 外文会议>Electron Devices Meeting, 2003. IEDM '03 Technical Digest. IEEE International >New method for temperature-dependent thermal resistance and capacitance accurate extraction in high-voltage DMOS transistors
【24h】

New method for temperature-dependent thermal resistance and capacitance accurate extraction in high-voltage DMOS transistors

机译:高压DMOS晶体管中与温度有关的热阻和电容精确提取的新方法

获取原文

摘要

This work reports on the self-heating-effect (SHE) characterization of high-voltage (HV) DMOSFETs and a simple yet accurate extraction methodology of the equivalent thermal impedance of the device (thermal resistance, R/sub TH/, and capacitance, C/sub TH/). Systematic pulsed-gate experiments are used to study the influence of pulse duration and duty factor on device SHE and optimal extraction conditions. It is found that in 100 V DMOSFETs, the SHE is cancelled by using pulses with duration shorter than 2 /spl mu/s and duty factors lower than 1:100. The new extraction method uses dedicated extraction plots exploiting the gradual canceling of SHE with pulse duration and a new analytical modeling including the temperature dependence of RTH, is validated. For the first time, we report on the temperature dependence of RTH, from 25/spl deg/C up to 150/spl deg/C, in both saturation and quasi-saturation regions of DMOS, which is shown to be a quasi-linear yet significant function of the device internal temperature. Moreover, another new result is a power low-dependent thermal capacitance, as suggested by our experiments. Finally, SPICE simulations are used to validate the proposed method, and, demonstrate that a thermal-dependent thermal resistance model is highly critical for accurate advanced simulation of HV DMOS ICs.
机译:这项工作报告了高压(HV)DMOSFET的自热效应(SHE)表征,以及器件等效热阻(热阻,R / sub TH /和电容, C / sub TH /)。系统的脉冲门实验用于研究脉冲持续时间和占空比对器件SHE和最佳提取条件的影响。发现在100 V DMOSFET中,通过使用持续时间小于2 / spl mu / s的脉冲和小于1:100的占空比的脉冲来消除SHE。新的提取方法使用专用提取图,利用脉冲持续时间逐步消除SHE,并验证了一个新的分析模型,其中包括RTH的温度依赖性。我们首次报道了DMOS的饱和度和准饱和度区域中RTH的温度依赖性,从25 / spl deg / C到150 / spl deg / C。器件内部温度的重要功能。此外,正如我们的实验所建议的那样,另一个新的结果是低功耗的热容。最后,使用SPICE仿真来验证所提出的方法,并证明依赖于热的热阻模型对于HV DMOS IC的精确高级仿真至关重要。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号