As electronic products are expected to become thinner and lighter, capable assembly processes for volume manufacturing are needed for small packages, such as 0201 components, CSPs, and flip-chips. In this work, a qualification vehicle was designed for 0201 packages, which includes more than 5,000 locations for 0201s and 1400 locations for 0402 components. The pad-to-pad spacing for 0201 components varies from 10 mils, 8 mils to 6 mils. No-clean solder pastes from several different vendors, and different types of 0201 components, were used. Detailed studies were carried out on important process parameters, including solder paste printing, component pick-and-place, and reflow. The post-reflow solder defects for different spacings were examined for the different solder pastes and component types.
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