Volume Assembly Qualification for 0201 Packages

摘要

In this work, a QV is designed for 0201 packages including more than 5,000 locations for 0201s and 1,400 locations for 0402 components, with the pad-to-pad spacing for 0201 components ranging from 0.010, 0.008 to 0.006". No-clean solder pastes and 0201 components from several different vendors are evaluated. Detailed studies are carried out on important process parameters, including solder paste printing, component pick-and-place and reflow. Based on this study, 0201 capacitors show a higher defect level than that of 0201 resistors, and solder pastes with higher tackiness exhibit a lower defect level for 0201 assembly.