Process characterization of PCB assembly using 0201 packages with lead-free solder

摘要

0201 assembly plays a very important role in the continuing miniaturization of electronics products. After a systematic study using Sn-Pb solder paste on pad design, machine evaluation, component qualification, and process optimisation. this study focused on the PCB assembly process for 0201 packages using Sn-Ag-Cu solder paste. The post-reflow solder defects for a range of different spacings were examined for the different solder pastes.