Developmental Halogen-Free High Performance Dielectric Substrates (with Different Reinforcement Supports) for the PCB/HDI and High-Frequency Applications

摘要

This paper presents a comparison of several resin systems on different support reinforcements including on Thermount~(~R) (or NWA), E-Glass (or E), and NE-Glass2 (SI~(TM)) (or NE). The resin systems compared in this paper include D5300 (Halogen-Free, High T_g or HFHT), N4000-13 (high-speed/low- oss or HSLL), and N4000-6 (high T_g FR4 or HTFR). It is proposed that the HFHT resin can be used for high-signal speed applications, chip-test boards, and in some cases, lead-free solder PCB processes. The parameters compared herein include thermal, mechanical, dielectric (i.e., stripline tests), flame-retardant character, and cure profile characteristics. This study gives the chip-test board, backplane, and wireless base-station designer valuable information concerning the functionality of these resin systems with different support reinforcements.