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HIGH-FREQUENCY SUBSTRATE AND MANUFACTURING METHOD FOR HIGH-PERFORMANCE, HIGH-FREQUENCY APPLICATIONS

机译:高性能,高频应用的高频基板和制造方法

摘要

A high-frequency substrate contains a carrier substrate, which has at least one fastening element. The fastening element is deposited on the outer region of the carrier substrate and protrudes over the outer region of the carrier substrate.
机译:高频基板包括载体基板,该载体基板具有至少一个固定元件。紧固元件沉积在载体基板的外部区域上并且突出在载体基板的外部区域上方。

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