Area array packages - materials requirements for diminishing devices

摘要

Continuously increasing proprtion of both consumer and professional electronic devices is portable enabling users to take advantage, for example, of e-mail or browse internet independently of their location. This requires high performance from the equipment that inevitably implies very high packaging efficiency; more functions and higher performance must be incorporated into an ever-smaller housing. Consequently, new packaging, substrate and interconnection technologies must be developed continuously.Area array packages, especially Chip Scale Package and Flip Chip, can provide close to ideal package size in relation to the integrated circuit size. It follows that also the dimensions of solder joints will be very small as compared to conventional surface mount technology, and thus much research and development work is ennded to overcome the challenges. In addition, printed wirin board design rules are shrinking to be able to perform effective routing for the new components. New manufacturing technologies and materials have to be developed parallel to the component and substrate technologies in order to ensure smooth and reliable assembly operations. This paper reviews challenges that the new technologies set on materials and presents some viable new solutions.