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Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference

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1.A global assessment of coolability for electronics thermal design based on thermodynamic aspects

机译：基于热力学方面的电子热设计冷却能力的全球评估
- 作者：Ken Ogiso
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
2.Packaging and thermal design of dense card-on-board electronics

机译：密集卡片电子产品的包装和热设计
- 作者：Roger Schmidt;Drew Horvath;Dennis Barringer;Steve Harris;Randy Kemink;Bill Maclachlan
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
3.Characterization of molding compounds and die attach materials for package warpage and solder joint reliability in chip scale packages (CSP)

机译：用于芯片型套装包装翘曲和焊接接头可靠性的模塑化合物和模具材料的表征（CSP）
- 作者：Masazumi Amagai
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
4.The use of phase change materials for electronic cooling applications: thermal design issues and example

机译：使用相变材料进行电子冷却应用：热设计问题和示例
- 作者：Randy Clarksean;Yitung Chen
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
5.Transient thermal management of portable electronics using phase change materials and time varying power dissipation

机译：使用相变材料和时间变化功耗的便携式电子设备的瞬态热管理
- 作者：Mark J. Vesligaj;Cristina H. Amon
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
6.Structural reliability of PBGA solder joints with the disturbed state concept

机译：PBGA焊点与受扰动状态概念的结构可靠性
- 作者：Jacob W. Zwick;Chandra S. Desai
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
7.Area array packages - materials requirements for diminishing devices

机译：区域阵列包装 - 递减设备的材料要求
- 作者：Petri J.Savolainen;Jorma K.Kivilahti;American Society of Mechanical Engineers
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
8.A pit-flaw model for static fatigue of pristine silica optical fibers

机译：原始二氧化硅光纤静态疲劳坑模型
- 作者：Mikio Muraoka;Hiroyuki Abe
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
9.Monte Carlo simulation of BGA failure distributions for virtual qualification

机译：Monte Carlo虚拟资格分布的BGA失效分布
- 作者：John W. Evans;Jillian Y. Evans;Reza Ghaffarian;Andrew Mawer;Kyoung-taeg Lee
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
10.Review and evaluation of approaches for thermomechanical analysis for stress, failure and reliability

机译：对压力，故障和可靠性的热机械分析方法的回顾与评估
- 作者：Chandra S. Desai
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
11.An experimental study on an enhanced microchannel heat sink for microelectronics applications

机译：微电子应用增强微通道散热器的实验研究
- 作者：Jerry K. Keska;A. Chuck Miller
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
12.Z-MAJIC{sup}(TM): a novel Z-interconnect approach for multi-chip modules

机译：Z-Majic {sup}（tm）：多芯片模块的一种新型z-interconnect方法
- 作者：Mark T. McCormack;Hunt Hiang;Solomon I. Beilin;Bill Chou;Mike Peters
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
13.A 12-step continuous supplier involvement checklist to accelerate component, sub-assembly and full system qualification

机译：12步连续供应商参与清单，以加速分量，子组件和全系统资格
- 作者：Thimmiah Gurunatha
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
- Reliability engineering;
- Rainbow tools;
- Continuous supplier involvement;
- Statistical process control;
14.Advanced package design using TCAD modeling tools

机译：使用TCAD建模工具进行高级包装设计
- 作者：H. P. Lien
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
- Thermal management;
- Technology CAD;
- Integrated simulation environment;
15.Investigation of variable frequency microwaves for cure of flip chip underfills

机译：倒装芯片底部填充的可变频率微波的研究
- 作者：Aravind Ramamoorthy;Patricia F. Mead
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
16.Complex temperature-vibration interactions on solder durability

机译：焊接耐用性复杂的温度振动相互作用
- 作者：James Cho;Kumar Upadhyayula;Abhijit Dasgupta
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
17.Multichip packages: new developments and applications

机译：MultiChip软件包：新的开发和应用程序
- 作者：E. Jan Vardaman
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
18.Analysis of correlation between accelerated thermal cycle test and power cycle test for a FC-PBGA device

机译：FC-PBGA装置加速热循环试验与电源循环试验的相关性分析
- 作者：Alex Tam;Leon Lopez
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
19.The supercsp package solution: a wafer level package

机译：SuperCSP封装解决方案：晶圆级包装
- 作者：Michelle M. Hou
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
20.Realization of buried passive components in low-temperature co-fired ceramic materials by thick-film techniques

机译：厚膜技术实现低温共烧陶瓷材料的埋地无源组件
- 作者：markku S. Lahti;Vilho E. Lantto;Seppo I. Leppavuori
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
21.Some challenges for molecular dynamics technique with consideration of the movement of free electrons in order to simulate thermodynamics by electronic current

机译：用于考虑自由电子运动的分子动力学技术的一些挑战，以模拟电子电流热力学
- 作者：Tomoaki Tsuji;Naoyuki Yanagi;Masaki Makino;Naotake Noda
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
22.Area array packages -materials requirements for diminishing devices

机译：区域阵列封装 - 递减设备的材料要求
- 作者：Petri J. Savolainen;Jorma K. Kivilahti
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
23.Using an electromagnetic simulation tool for demonstrations in a course on electronics packaging

机译：在电子包装课程中使用电磁仿真工具进行演示
- 作者：Harry Kroger;Jiayuan Fang;Yuzhe Chen
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
24.An experimental study on liquid cooling of high-power IC chips

机译：高功率IC芯片液体冷却试验研究
- 作者：Satoru Gima;Toshio Tomimura;Xing Zhang;Motoo Fujii
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
25.Analysis and mitigation of field failures caused by copper corrosion migration across plastic package surfaces

机译：塑料封装表面铜腐蚀迁移引起的现场故障分析与减轻
- 作者：Steven C. Anderson;Joel A. Self;Steve Mitchell
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
26.Nest generation of microelectronic packaging education in U.S.: a perspective on needs, challenges and status

机译：巢在美国微电子包装教育的生成.:对需求，挑战和地位的视角
- 作者：Rao Tummala;Leyla Conrad;Gary May
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
27.Optical coupling efficiency of bidirectional transceiver chip and fiber by using refractive index controlling medium

机译：双向收发器芯片和光纤光学耦合效率使用折射率控制介质
- 作者：Jae-Shik Choi;Gwan-Chong Joo;Sang-Hwan Lee;Nam-Hwang;Seung-Goo Kang;Hee-Tae Lee;Min-Kyu Song
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
28.Propagation of interface edge cracks by mechanical and thermal strains

机译：界面边缘裂缝通过机械和热菌株传播
- 作者：Wei Hin Wong;Li Cheng;Yong-Wei Zhang
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
29.Thermomechanical diagnostics of flip-chip/BGA structures using phase-shifting electronic speckle pattern interferometry

机译：使用相移电子散斑图案干涉测量的倒装芯片/ BGA结构的热机械诊断
- 作者：P. Zhou;K. E. Goodson
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
30.Dynamic assessment of a miniaturized spaceborne command data handling in pour palm (C DHIYP)

机译：浇注棕榈（C＆Dhiyp）的小型化星载命令和数据处理的动态评估
- 作者：Sharon X. Ling;Binh Q. Le;Richard F. Conde
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
31.Novel anisotropically conductive film for area array packaging

机译：用于区域阵列包装的新型各向异性导电膜
- 作者：Matthew J. Holloway;Mary B. Ward;Luana V. Scully
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
32.Reliability test methodology using thermo-mechanical deflection

机译：可靠性测试方法使用热机械偏转
- 作者：John H. L. Pang;K. H. Ang;Z. P. Wang;X. Q. Shi
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
33.Alternate alloy bump interconnect technol ogies and flip chip applications

机译：备用合金凸块互连技术ogies和倒装芯片应用
- 作者：Melissa E. Grupen-Shemansky;Patrick Thompson;Jong-Kai Lin;American Society of Mechanical Engineers
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
34.Three dimensional Elastoplastic and creep analyses of a low cost solder-bumped flip-chip chip scale package (CSP) assembly

机译：低成本焊料碰撞倒装芯片芯片秤包（CSP）组装的三维弹性塑料和蠕变分析
- 作者：John H. Lau
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
35.Alternate alloy bump interconnect technologies and flip chip applications

机译：替代合金凸块互连技术和倒装芯片应用
- 作者：Melissa E. Grupen-Shemansky;Patrick Thompson;Jong-Kai Lin
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
36.Reliability analysis of BGA packages - a tool for design engineers

机译：BGA包装的可靠性分析 - 设计工程师的工具
- 作者：James W. Jones;Jason Li;Yuichi Yamazaki;Jidong Yang;Masaki Shiratori;Qiang Yu
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
37.An analysis of heat flux limits for electronic components on a finned substrate containing a PCM

机译：含有PCM的翅片基板上的电子元件的热通量限制分析
- 作者：Randy Clarksean;Yitung Chen;M. Marongiu
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
38.Fracture behavior of underfill resins and their application to flip-chip on organic substrate assemblies

机译：底部填充树脂的断裂行为及其在有机基材组件上倒装芯片的应用
- 作者：Raymond A. Pearson;Thomas B. Lloyd;Herman F. Nied
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
39.Large scale parallel simulations for the assembly of a flip-chip component to a printed circuit board

机译：用于将倒装芯片组件组装到印刷电路板的大规模并行模拟
- 作者：C. Bailey;K. McManus;D. Wheeler;H. Lu;M. Cross;P. Chow;C. Addison
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
40.A time dependent field return model for telecommunication hardware

机译：电信硬件的时间依赖性现场回报模型
- 作者：Orjan Hallberg;Joakim Lofberg
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
41.Thermal design method for a hyper heat dense notebook PC

机译：高温密集笔记本电脑的热设计方法
- 作者：Kazuaki Yazawa;Bunsho Lin;Minoru Okuda
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
42.Performance characteristics of confined impinging air jets with surface enhancement

机译：屏蔽表面增强局限性撞击空气喷射的性能特征
- 作者：Luis A. Brignoni;Suresh V. Garimella
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
43.Development and testing of an ambient thermal storage unit for pulsed load applications

机译：用于脉冲负载应用环境热存储单元的开发和测试
- 作者：David C. Bugby;Stephen J. krein;Jeong H. Kim
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
44.Localized thermal cycling: a faster and controlled accelerated testing approach for surface mount electronics

机译：局部热循环：表面安装电子设备的更快和控制的加速测试方法
- 作者：Rajashekar S. Pappu;Yogendra K. Joshi;Abhijit Dasgupta
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
45.Advances in materials and processes for flip chip packaging

机译：倒装芯片包装材料和工艺的进步
- 作者：Raj N. Master;Mohammed Khan;Maria Guardado;Orion Starr
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
46.Residual stress near by the interface of thin CVD diamond film and silicon substrate

机译：通过薄CVD金刚石膜和硅衬底接近近的残余应力
- 作者：Shoji Kamiya;Masaki Sato;Masumi Saka;Hiroyuki Abe
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
47.Efficient validation testing of pressure sensors using doe for production line validation tests

机译：使用DOE用于生产线验证测试的压力传感器的高效验证测试
- 作者：Dale R. Sogge
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
48.Alternative accelerated testing method for localization of solder fatigue failures on electronic circuit cards

机译：电子电路卡上焊料疲劳故障定位的替代加速试验方法
- 作者：Scott Sealing;Abhijit Dasgupta
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
49.Development of reworkable underfills, materials, reliability and processing

机译：开发可再加工的底线，材料，可靠性和加工
- 作者：Lawrence Crane;Afranio Torres-Filho;Erin Yaeger;Christopher K. Ober;Shu Yang;Jir-shyr Chen;R. Wayne Johnson
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
50.Thermal control of horizontally mounted heat sources using phase change materials

机译：使用相变材料热控制水平安装的热源
- 作者：Debabrata Pal;Yogendra K. Joshi
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
51.A genetically optimized electrothermal parallel algorithm

机译：一种遗传优化的电热并行算法
- 作者：Boguslaw Butrylo;Andrzej Jordan;Adam Skorek
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
52.A unified constitutive model based on disturbed state concept and multi-domain method for design and reliability in electronic packaging

机译：一种基于干扰状态概念的统一构型和电子包装设计和可靠性的多域方法
- 作者：Mostafa Rassaian;Chandra S. Desai;R. Whitenack;Jung-Chuan Lee
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
53.Rapid qualification of foundries or semiconductor process changes using rapid reliability process control tests

机译：使用快速可靠性过程控制测试，铸造或半导体过程的快速资格变化
- 作者：Timothy E. Turner
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
54.Thermomechanical fatigue life of chip scale packages

机译：芯片鳞片套件的热机械疲劳寿命
- 作者：Qizhou Yao;Jianmin Qu;Sean X. Wu
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
55.An optimisation study of underfill dispensing process

机译：填埋分配过程的优化研究
- 作者：Y. C. Chia;S. H. Lim;K. S. Chian;S. Yi;W. T. Chen
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
56.Experimental characterization of copper-encapsulant interfacial fracture toughness for a peripheral array package

机译：外围阵列包装铜包封型界面骨折韧性的实验表征
- 作者：Viswanathan Sundararaman;Suresh K. Sitaraman
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
57.Design and integration considerations for 3D flex based electronic packaging

机译：基于3D Flex的电子包装的设计与集成考虑因素
- 作者：W. B. Morrison;T. A. Railkar;A. P. Malshe;T. G. Lenihan;W. D. Brown
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年
58.Development of high-productivity underfill process and equipment

机译：开发高生产率底部填充工艺和设备
- 作者：Teikou Odashima;Mikio Matsui;Shoji Yamamoto;Takaki Kuno;Hirotaka Okamoto
- 会议名称：《Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference》 | 1999年