首页> 外文会议>Electron Devices Meeting, 1999. IEDM Technical Digest. International >High performance strained-Si p-MOSFETs on SiGe-on-insulator substrates fabricated by SIMOX technology
【24h】

High performance strained-Si p-MOSFETs on SiGe-on-insulator substrates fabricated by SIMOX technology

机译:通过SIMOX技术在绝缘体上GeGe衬底上的高性能应变Si p-MOSFET

获取原文

摘要

We have proposed a new MOSFET structure, strained-Si/Si/sub 0.9/Ge/sub 0.1/-on-Insulator (SSGOI) MOSFETs applicable to the sub-100 nm generation. This SSGOI structure was successfully fabricated by the combination of SIMOX technology and the Si re-growth technique. The strained-Si in SSGOI was found to have good crystal quality and very flat interfaces. SSGOI p-MOSFETs exhibited good FET characteristics. It was demonstrated, for the first time, that the hole mobility of the SSGOI p-MOSFETs is higher that of the universal mobility of conventional Si p-MOSFETs.
机译:我们已经提出了一种新的MOSFET结构,适用于100 nm以下的绝缘硅/ Si / sub 0.9 / Ge / sub 0.1 /绝缘子上(SSGOI)MOSFET。通过结合SIMOX技术和Si再生长技术成功制造了这种SSGOI结构。发现SSGOI中的应变硅具有良好的晶体质量和非常平坦的界面。 SSGOI p-MOSFET表现出良好的FET特性。首次证明,SSGOI p-MOSFET的空穴迁移率高于传统Si p-MOSFET的通用迁移率。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号