首页> 外文会议>Electron Devices Meeting, 1999. IEDM Technical Digest. International >High Al-content AlGaN/GaN HEMTs on SiC substrates with very high power performance
【24h】

High Al-content AlGaN/GaN HEMTs on SiC substrates with very high power performance

机译:SiC衬底上的高Al含量AlGaN / GaN HEMT,具有非常高的功率性能

获取原文

摘要

With the promise of a new level of power performance at microwave frequencies, GaN-based high-mobility-transistors (HEMTs) have attracted sustained research effort and shown steadfast improvements. Previous state-of-the-art included power densities of 5.3-6.9 W/mm at 10 GHz from small devices, as well as a total output power of 9.1 W at 7.4 GHz from a 3-mm-wide device. This performance was obtained using AlGaN/GaN HEMTs grown on SiC substrates for superior heat dissipation. However, these devices used a low Al mole fraction of 14% in the AlGaN layer, which had been shown to be less preferred in an earlier study with devices grown on sapphire substrates. In this work, high Al content AlGaN/GaN HEMTs on SiC substrates are demonstrated with remarkable performance enhancement.
机译:基于在微波频率下将功率性能提高到新水平的承诺,基于GaN的高迁移率晶体管(HEMT)吸引了持续的研究努力并显示出坚定的进步。以前的最新技术包括小型设备在10 GHz时的功率密度为5.3-6.9 W / mm,以及3毫米宽设备在7.4 GHz时的总输出功率为9.1W。使用在SiC衬底上生长的AlGaN / GaN HEMT可获得出色的散热性能。但是,这些器件在AlGaN层中使用了14%的低Al摩尔分数,这在较早的研究中已证明在蓝宝石衬底上生长的器件不太优选。在这项工作中,SiC衬底上的高Al含量AlGaN / GaN HEMT被证明具有显着的性能增强。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号