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Impact of strain relaxation of AlGaN barrier layer on the performance of high Al-content AlGaN/GaN HEMT

机译:AlGaN势垒层应变松弛对高Al含量AlGaN / GaN HEMT性能的影响

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摘要

The effects of strain relaxation of AIGaN barrier layer on the conduction band profile, electron concentration and two-dimensional gas (2DEG) sheet charge density in a high Al-content AlGaN/GaN high electron mobility transistor (HEMT) are calculated by self-consistently solving Poisson's and Schrodinger's equations. The effect of strain relaxation on dc I-V characteristics of Al_xGa_(1-x)N/GaN HEMT is obtained by developing a nonlinear charge-control model that describes the accurate relation of 2DEG sheet charge density and gate voltage. The model predicts a highest 2DEG sheet charge density of 2.42x10~(13) cm~(-2) and maximum saturation current of 2482.8 mA/mm at a gate bias of 2 V for 0.7 mu m Al_(0.50)Ga_(0.50)N/GaN HEMT with strain relaxation r=0 and 1.49x10~(13) cm~(-2) and 1149.7 mA/mm with strain relaxation r=1. The comparison between simulations and physical measurements shows a good agreement. Results show that the effect of strain relaxation must be considered when analyzing the characteristics of high Al-content AlGaN/GaN HEMT theoretically, and the performance of the devices is improved by decreasing the strain relaxation of AIGaN barrier layer.
机译:通过自洽计算出AlGaN / GaN高电子迁移率晶体管(HEMT)中AIGaN势垒层的应变松弛对导带分布,电子浓度和二维气体(2DEG)薄层电荷密度的影响解决泊松和薛定inger方程。通过建立描述2DEG薄板电荷密度与栅极电压精确关系的非线性电荷控制模型,可以得到应变松弛对Al_xGa_(1-x)N / GaN HEMT的dc I-V特性的影响。该模型预测在0.7μm的Al_(0.50)Ga_(0.50)下,在2 V的栅极偏置下,最高2DEG薄板电荷密度为2.42x10〜(13)cm〜(-2),最大饱和电流为2482.8 mA / mm。应变弛豫r = 0的N / GaN HEMT为1.49x10〜(13)cm〜(-2),应变弛豫r = 1的N / GaN HEMT为1149.7 mA / mm。模拟和物理测量之间的比较显示出很好的一致性。结果表明,从理论上分析高Al含量的AlGaN / GaN HEMT的特性时,必须考虑应变松弛的影响,并且通过减小AIGaN势垒层的应变松弛来改善器件的性能。

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