3-D Inspection for the Verification of Fine Pitch and Ball Grid Array Solder Paste Deposits

摘要

Integrated circuit packages with high lead counts nad fine pitches are becoming routine in surface mount manufactuing. The solder paste stencil print process becomes increasingly critical as the component lead pitch decreases. Visual inspection is extremely difficult and at best can only determine ara of converage. Studies have shown that volume is the most critical parameter in forming a good solder joint.