Anyone closely involved with the process of surface mount assembly is familiar with the challenges of materials deposition. This complex process requires highly develoepd materials and equipment to produce reliable results. In the past, SMT adhesive deposition has been accomplished primarily by high speed automatic dispensing, pin transfer, and stencil printing. Each of these methods has its strengths and weaknesses and, as the needs of the SMT assembly industry change, careful consideration must be made to determine the appropriate method for new applications. The industry of high volume surface mount assembly is very competitive, with product designs changing rapidly. To remain profitable, assembly houses must maintain a high quality standard, while maximizing throughput and flexibility. Rising to meet the challenges of this fast-paced industry, SMT placement equiment manufacturers are now producing machines capable of more than 70,000 placements per hour. As a result, the assembly business is shifting the focus from placement equipment to materials deposition equipment.
展开▼
