首页> 外文期刊>Global SMT & Packaging: European Edition (Surface Mount Technology) >Conquering SMT stencil printing challenges with today's miniature components: Is electroform technology the right solution?
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Conquering SMT stencil printing challenges with today's miniature components: Is electroform technology the right solution?

机译:用当今的微型组件克服SMT模板印刷的挑战:电铸技术是正确的解决方案吗?

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摘要

This article discusses new developments in stencil laser and material technology and shows how these advancements, when combined, provide comparable and cost-effective alternatives to traditional electroformed stencils. The results are improved yields, cycle time reductions and significant cost savings.
机译:本文讨论了模版激光和材料技术的新发展,并展示了这些先进技术如何结合起来,可以提供与传统电铸模版相当且具有成本效益的替代方案。结果是提高了产量,减少了周期时间并节省了大量成本。

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