This study focuses on the development of next generationintegrated CAD-based software tools to simulate reactive flow phenomenaduring plastic encapsulation of ICs. These tools are applicable to bothexisting production packages and future configurations, such as mouldedMCMs, chip scale packages, ball grid arrays, and ultra-thin QFPs.Successful flow simulation for accurate encapsulation process modellingis strongly dependent on input data for cure kinetics and mouldingcompound rheology. Studies of rheokinetic relations for epoxy systemshave investigated model systems rather than commercial materials, mainlybecause model systems have slower cure kinetics that are betterunderstood than fast (<1 min) commercial resins. In this study, acommercial epoxy moulding compound, Sumikon EME 6300 HN, is explored.Our approach for conversion and rheological data collection on thesesystems involves initial models of epoxy compounds with reduced catalystloading rather than standard formulations. As gelation time for thesesystems is much longer, kinetics and rheological data collection in thepre-gel region is simplified. A Kamal autocatalytic kinetic equation isused to model the change in conversion with reaction time duringpolymerization of epoxy systems. Differences are noted in the kineticsbetween systems reacted isothermally at a typical process temperature(~170° C) and those reacted with a slow (<15° C/min) dynamictemperature ramp. Viscosity data for both isothermal and dynamic modeswere collected. Use of the Castro-Macosko equation to model pre-gelregion viscosity conversion data is presented
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