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High-frequency performance of GE high-density interconnect modules

机译:GE高密度互连模块的高频性能

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An effort to determine the high-frequency electrical characteristics of the HDI (high-density interconnect) process and validate models and analytical tools is described. There were seven different designs fabricated, five with only passive structures and two with both passive and active structures. These coupons were designed with many different line structures in order to determine the electrical characteristics of HDI at high (<500-MHz) frequencies. A few of the structures used on the coupons and their respective electrical performances are discussed. The analytical tools derived from basic transmission line theory appear adequate to explain observed values of insertion loss, reflection loss, and crosstalk. In addition, the measurements confirmed the commonly accepted values for the electrical parameters of the GE HDI process (dielectric constant, loss tangent, and electrical resistivity). The crosstalk measurements demonstrate that sufficient isolation exists for practical system designs up to frequencies of 9 GHz in the stripline configuration, and even in the less-tolerant microstrip configuration good isolation is obtained without use of excessive spacing or guard conductors. The major limitation at the higher frequencies appears to be the insertion loss, which approaches 10 dB in some of the longer-length lines considered.
机译:描述了确定HDI(高密度互连)过程的高频电气特性并验证模型和分析工具的工作。共制造了七种不同的设计,其中五种仅具有无源结构,而两种具有无源和有源结构。为了确定HDI在高频率(<500-MHz)时的电气特性,这些样片设计有许多不同的线结构。讨论了在试样上使用的一些结构及其各自的电性能。来自基本传输线理论的分析工具似乎足以解释插入损耗,反射损耗和串扰的观测值。此外,测量结果证实了GE HDI工艺的电气参数(介电常数,损耗角正切和电阻率)是公认的值。串扰测量表明,对于带状线配置中高达9 GHz频率的实际系统设计,存在足够的隔离,即使在容差较小的微带配置中,也无需使用过多的间距或保护导体即可获得良好的隔离。较高频率下的主要限制似乎是插入损耗,在某些考虑的较长长度的线路中,插入损耗接近10 dB。

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