一种高频微波高密度互连板制作技术研究

摘要

结合当今的电子产品发展方向，本文以一款叠孔HDI、陶瓷材料PCB为例，概述其制作难点，并就问题点提出改善方法。%By combining current electronic product development direction, this paper takes stacked up HDI stupalith PCB as an example, makes the overview of its production dififculties, and puts forward improvement methods on the problem.