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Rapid prototyping using high density interconnects

机译:使用高密度互连进行快速原型制作

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This paper introduces the (DIODES) system for the rapid prototyping of DSP electronic systems. DIODES merges silicon compiler and high-density interconnect technology with the goal of prototyping hardware systems as quickly as possible --- within one day. Working from a high-level algorithmic description of a DSP algorithm, DIODES will determine which chips from an inventory of specially designed chips are needed to implement the design. These chips are then placed on a prepared substrate and routed together using computer controlled laser lithography to produce a hardware implementation of the design.
机译:本文介绍了DSP电子系统快速原型设计的(二极管)系统。二极管将硅编编译器和高密度互连技术合并,并在一天内尽快解决硬件系统的目标。从DSP算法的高级算法描述工作,二极管将确定需要专门设计的芯片库存中的哪些芯片来实现设计。然后将这些芯片置于制备的基板上并使用计算机控制的激光光刻一起排列在一起,以产生设计的硬件实现。

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