高频高密度互连刚挠结合板制作技术介绍

摘要

结合当今的电子产品发展方向，探索出一款12层，集合3阶HDI、高频板材、刚挠结合三种特性于一身的印制板的制作技术难点，并就问题点提出改善方法。%Considering the development of electronic products, this paper explored the PCB production technical dififculties of a 12 layer, with three kinds of characteristics 3+N+3 structure of HDI, high frequency, rigid-Flex, and the improvement method of problem is proposed.