首页> 外文会议>Electronic Components and Technology Conference, 1992. Proceedings., 42nd >Reliability qualification test for circuit boards exposed to airborne hygroscopic dust
【24h】

Reliability qualification test for circuit boards exposed to airborne hygroscopic dust

机译:暴露于空气吸湿性粉尘的电路板的可靠性鉴定测试

获取原文

摘要

The insulation resistance of circuit boards was monitored after different hygroscopic salts were deposited. By choosing different salts and concentrations, various resistance versus humidity characteristics were achieved. Insulation resistance as high as 10/sup 11/ Omega was lowered to 10/sup 6/ Omega at 40% relative humidity after controlled contamination with calcium chloride. For purposes of designing a qualification tool to identify design robustness, the salt and contamination technique should give controllable and reproducible characteristics. Spin coating and spraying of atomized particulates were investigated. Sodium sulfide or, as alternatives, potassium carbonate or calcium chloride was identified as a suitable salt for the test. Although these materials are not typically found in airborne hygroscopic dust, their use offers a controllable means to simulate the loss of surface insulation resistance and the failures that can result. After being covered by the test salt, the board under test is plugged back into its host system via an extension card. The local environment around the circuit board is controlled and maintained at 25 degrees C and high humidity. A functional test in normal operation of the circuit board is then performed.
机译:沉积不同的吸湿盐后,监测电路板的绝缘电阻。通过选择不同的盐和浓度,获得了各种抗湿特性。在控制氯化钙污染后,在40%相对湿度下,绝缘电阻高达10 / sup 11 /Ω,降低到10 / sup 6 /Ω。为了设计鉴定工具来确定设计的坚固性,盐和污染技术应提供可控制和可再现的特性。研究了旋涂和雾化微粒的喷涂。硫化钠或作为替代品的碳酸钾或氯化钙被确定为该测试的合适盐。尽管这些材料通常不存在于机载吸湿性粉尘中,但是它们的使用提供了一种可控制的方法来模拟表面绝缘电阻的损失以及可能导致的故障。被测试盐覆盖后,被测试的板通过扩展卡重新插入其主机系统。电路板周围的局部环境被控制并保持在25摄氏度和高湿度下。然后执行电路板正常运行中的功能测试。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号