CIRCUIT FOR EVALUATING INSULATION RELIABILITY OF INTERLAYER CONNECTION CIRCUIT PART OF PRINTED WIRING BOARD, AND TEST METHOD FOR EVALUATING INSULATION RELIABILITY THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a circuit for evaluating insulation reliability of an interlayer connection circuit part of a printed wiring board, in which time required for quality determination related to insulation reliability of an interlayer connection circuit part of a printed wiring board is short, and specification of an insulation deteriorated portion is performed more easily than before, and also to provide a test method for evaluating insulation reliability of the interlayer connection circuit part of the printed wiring board using the same.SOLUTION: A circuit for evaluating insulation reliability of an interlayer connection circuit part of a printed wiring board includes: an insulation layer 2; an upper circuit group 20 and a lower circuit group 30 which are isolated from each other in a thickness direction by the insulation layer 2; and five via arrays A-E, each of which has a plurality of vias 3-5 for penetrating through the insulation layer 2 located between the upper circuit group 20 and the lower circuit group 30. A test method for evaluating insulation reliability of the interlayer connection circuit part of the printed wiring board is provided.SELECTED DRAWING: Figure 2