STRUCTURE OF EVALUATING INSULATION RELIABILITY OF INTERLAYER CONNECTION CIRCUIT PART OF PRINTED WIRING BOARD, AND METHOD OF EVALUATING THE INSULATION RELIABILITY

摘要

PROBLEM TO BE SOLVED: To provide a structure of evaluating insulation reliability of an interlayer connection circuit part of a printed wiring board capable of a highly accurate and highly reliable insulation evaluation test even when an inter-wall insulation distance is ≤0.1 mm, and to provide an evaluation test method using the same.;SOLUTION: The structure of evaluating insulation reliability of the interlayer connection circuit of the printed wiring board is characterized in that: on an inner layer circuit-containing substrate includes an insulation layer inside and equipped with surface insulation layers on upper layers of both of first and second conductor layers provided respectively on one surface and the other surface of a copper-plated laminate having a plurality of electric wires formed on both conductor layers, a series chain line is formed including a through-via having a conductor on an internal wall to have the respective electric wires of the first and second conductor layers alternately connected; a width of each wire is not larger than a diameter of the through-via; and an end of the conductor layer provided on the internal wall of the through-via is located inward from the surface of the surface insulation layer. The method of evaluating the insulation reliability is also provided using the structure.;COPYRIGHT: (C)2009,JPO&INPIT