首页> 外文会议>Indium Phosphide and Related Materials, 1991., Third International Conference. >Influence of domain formation on the V/sub ds/ dependence of noise and gate leakage in InGaAs FETs
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Influence of domain formation on the V/sub ds/ dependence of noise and gate leakage in InGaAs FETs

机译:域形成对InGaAs FET中V / sub ds /噪声和栅极泄漏的依赖性的影响

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A model for high gate leakage currents in InGaAs-channel FETs is described. Such leakage is caused by running gate metal down an unpassivated mesa. Even when an airbridge is used, gate leakage is higher than anticipated from the sum of source-gate and drain-gate diode currents. Measurements of typical leakage and transconductance for a 1 mu m HFET at V/sub ds/=2 V are presented. The leakage is much higher than that observed at V/sub ds/=0 V. It is shown that, in JFETs and HFETs, reducing the doping level leads to a near-exponential decrease in leakage currents. Properly designed HEMTs can have low gate leakage in the high gain region.
机译:描述了InGaAs沟道FET中高栅极漏电流的模型。这种泄漏是由于栅极金属沿未钝化的台面流过引起的。即使使用空气桥接器,栅极泄漏也会比根据源极-栅极和漏极-栅极二极管电流之和所预期的要高。给出了在V / sub ds / = 2 V时1μmHFET的典型泄漏和跨导的测量结果。泄漏比在V / sub ds / = 0 V时观察到的泄漏要高得多。结果表明,在JFET和HFET中,降低掺杂水平会导致泄漏电流几乎呈指数下降。正确设计的HEMT可以在高增益区域具有较低的栅极泄漏。

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